Bond-pad with pad edge strengthening structure

摘要

A bond pad structure for use in wire bonding applications during the packaging of semiconductor devices which minimizes the bond pad lift-off problem to provide improved stability. The bond pad structure contains: (1) a dielectric layer 4 formed on a first conductive layer 5; (2) a base conductive layer (whose outer boundary as viewed from the top is indicated as line 11) formed in the dielectric layer on top of the first conductive layer, the base conductive being extended to form an overhang layer (whose outer boundary is shown as line 13) which is disposed above the dielectric layer; and (3) at least one recessed portion 20 formed in the overhang layer. In a preferred embodiment, the bond pad is rectangular in shape and the recessed portion has the shape of an elongated rim that covers two corners of the base conductive layer.