发明名称 Copper alloy sliding material
摘要 Disclosed is a copper alloy sliding material comprising 0.5 to 15 mass % Sn and 0.1 to 10 vol % of hard particles consisting of one or more selected from WC, W2C and Mo2C. The hard particles have preferably an average particle size of 0.1 to 10 mum, whereby they are dispersed in the copper alloy matrix so as to make the sliding-contact surface uneven, from which the hard particles protrude partially. The sliding material comprises an amount or a total amount of not more than 40 mass % of one or more selected from Ni, Ag, Fe, Al, Zn, Mn, Co, Si and P, an amount or a total amount of not more than 10 mass % of Bi and/or Pb, and/or an amount or a total amount of not more than 10 vol % of a solid lubricant comprising BN, graphite, MoS2 and/or WS2.
申请公布号 US2001021353(A1) 申请公布日期 2001.09.13
申请号 US20000749442 申请日期 2000.12.28
申请人 SAKAI KENJI;KAWAKAMI NAOHISA;KURIMOTO SATORU;INABA TAKASHI;YAMAMOTO KOICHI;SHIBAYAMA TAKAYUKI 发明人 SAKAI KENJI;KAWAKAMI NAOHISA;KURIMOTO SATORU;INABA TAKASHI;YAMAMOTO KOICHI;SHIBAYAMA TAKAYUKI
分类号 B22F5/00;C22C9/00;C22C9/01;C22C9/02;C22C9/04;C22C9/05;C22C9/06;C22C9/08;C22C9/10;C22C32/00;F16C33/12;(IPC1-7):C22C9/02 主分类号 B22F5/00
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