SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, LEAD FRAME, METHOD OF MANUFACTURING LEAD FRAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH LEAD FRAME

摘要

A leadless surface-mount mold semiconductor device comprises a semiconductor element, a resin package enclosing the semiconductor element, terminals projecting on the mount side of the resin package, and wires for connection between the terminal and electrode pads on the semiconductor element. The semiconductor element has a heat sink on its lower side to remove heat from the semiconductor element to improve cooling performance.