| 摘要 |
PURPOSE: A dry etching apparatus is provided to prevent a semiconductor wafer from polluting due to an outgrowth by arranging an outlet on the sidewall of a processing chamber to exhaust the outgrowth on the upper side of a wafer. CONSTITUTION: The first outlet(110) is arranged on the upper side of a processing chamber(100), and the one or more second outlet(116) is arranged on the sidewall of the processing chamber(100) while being the same level as the upper side of a semiconductor wafer(104). A vacuum pump(130) is connected with the first outlet(110) and the second outlet(116). The first valve(112) and the second valve(118) are arranged to the connecting part of the first outlet(110) and the second outlet(116), respectively.
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