发明名称 Apparatus for processing resin sealed lead frame
摘要 Resin sealed lead frames are processed by modular processing work stations related in number to a plurality of steps used in processing the lead or leads of the resin sealed lead frame. The work stations are separate modules which are detachably interconnected, whereby the number of modules can be exactly correlated to the number of steps actually required for processing the lead or leads of the resin sealed lead frame. As required, modules can be added or omitted. The resin sealed lead frame is sequentially advanced through the modules in steps corresponding to at least two pitches, whereby one pitch is defined as the on-center spacing between two neighboring products on the lead frame. Such feed advance permits performing at least two processing steps simultaneously. Thus, the method for processing the resin sealed lead frame and the apparatus therefore are adaptable to a change in the type of processing and to the production volume.
申请公布号 US2001021409(A1) 申请公布日期 2001.09.13
申请号 US20010851227 申请日期 2001.05.08
申请人 TOWA CORPORATION 发明人 OSADA MICHIO;HIDAKA TETSUO;HORIUCHI KAZUO
分类号 H01L21/48;H01L21/56;(IPC1-7):A61B5/103 主分类号 H01L21/48
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