发明名称 MODULAR PLATFORM ASSEMBLY
摘要 <p>A modular platform assembly for providing at least one breadboard surface level above a table (T) includes a rectangular breadboard plate (20) having holes (23) therein, a pillar member (30, 60) for supporting each corner of the rectangular breadboard plate (20), and a base member for supporting each pillar member (30, 60) on a table top. By using multiple breadboard plates (20) and multiple pillars (30, 60), a first surface level of varying horizontal dimensions can be provided, as well as multiple vertically-spaced levels. The invention enables the creation of enlarged three-dimensional work surfaces above a table top, thus enhancing utilization of space in a small area.</p>
申请公布号 WO2001067373(A2) 申请公布日期 2001.09.13
申请号 US2001007227 申请日期 2001.03.08
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