发明名称 Method for manufacturing electronic parts and apparatus for manufacturing thin films
摘要 In a method for manufacturing electronic parts by laminating metal thin films and insulating thin films on a support, a mold releasing agent is applied to the support before the start of lamination. Alternatively, the mold releasing agent is applied to the surface of the laminate during the lamination step, and then lamination is resumed. Therefore, the laminate can be prevented from cracking when the laminate is separated from the support or divided into plural pieces in the lamination direction. Thus, the reliability and productivity of electronic parts improve.
申请公布号 US2001020754(A1) 申请公布日期 2001.09.13
申请号 US20010847469 申请日期 2001.05.02
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HONDA KAZUYOSHI;ECHIGO NORIYASU;ODAGIRI MASARU;SUNAGARE NOBUKI
分类号 H01G4/33;H01G4/18;H01G4/30;H03H3/00;(IPC1-7):B29C33/58;B29C41/32 主分类号 H01G4/33
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