| 摘要 |
An apparatus for transferring a plate member such as a wafer by supporting the plate member with a plurality of support pins, and vacuum-sucking the plate member with a suction disk without allowing the suction disk to make contact with the plate member. Vacuum generated in a space between the plate member (51) and the suction disk (8) is introduced into a space between a hollow resilient body (3) via a conduit (11) formed in a lever (9), to drive the suction disk by expansion/contraction of the hollow resilient body, to attract the plate member without allowing the suction disk to make contact with the plate member, and to hold the plate member on the support pins (5). The suction disk has an outer ring area (49) on a suction surface (S) having at least one continuous groove surrounding the inner area of the suction disk. Vacuum is introduced into the inside of the suction surface (S) to suck the plate member.
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