发明名称 |
Millimeter wave module and radio apparatus |
摘要 |
A millimeter wave module includes a silicon substrate with first and second cavityes formed by anisotropic etching on the silicon substrate, and a glass substrate having a microstrip filter pattern and microbumps for connecting the glass substrate to the silicon substrate. A filter is provided using an air layer as a dielectric disposed in the first cavity. An MMIC is mounted by the flip chip method over the second air layer. A coplanar waveguide is on the silicon substrate for connecting the filter and MMIC. The filter having low loss is achieved because it has the microstrip structure using air as an insulating layer. Also change in characteristics of the MMIC during mounting is eliminated because the MMIC is protected by contacting air. Accordingly, the millimeter wave module has excellent characteristics and is made using a simple method.
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申请公布号 |
US2001020879(A1) |
申请公布日期 |
2001.09.13 |
申请号 |
US20010833280 |
申请日期 |
2001.04.12 |
申请人 |
TAKAHASHI KAZUAKI;SANGAWA USHIO |
发明人 |
TAKAHASHI KAZUAKI;SANGAWA USHIO |
分类号 |
H01L23/12;H01P1/203;H01P3/02;H01P3/08;H01P5/08;H01P11/00;(IPC1-7):H01P1/203 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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