发明名称 MOLD RELEASE FILM
摘要 PROBLEM TO BE SOLVED: To provide a mold release film useful for various type mold release applications for protection an adhesive layer such as a liquid crystal polarizing plate, a phase difference plate or the like or for a ceramic mold release or the like having a small oligomer precipitate amount and a small transfer of, for example, a silicone component in the mold release layer. SOLUTION: The mold release film comprises a coating layer and a mold release layer having a residual adhesive ratio of 80% or more, sequentially provided on one side surface of a polyester film. In this case, at least one of the coating layer and the mold release layer contains a compound having an amino group. The film satisfies OL<=3.0 (mg/m2) (1) and N×Wf>=0.5 (mg/m2) (2), wherein OL is an oligomer amount extracted by a dimethylformaldehyde from a surface of the mold release layer of the mold release film after heat treating at 180 deg.C for 10 min, N is a nitrogen content (ppm) detected by an indophenol blue absorbance method via a kjeldahl decomposition from the mold release film, and Wf is a weight per unit area of the mold release film (mg/m2).
申请公布号 JP2001246698(A) 申请公布日期 2001.09.11
申请号 JP20000062932 申请日期 2000.03.08
申请人 MITSUBISHI POLYESTER FILM COPP 发明人 IZAKI KIMIHIRO
分类号 B32B27/00;B32B27/36;C09D5/20;C09D183/08;(IPC1-7):B32B27/00 主分类号 B32B27/00
代理机构 代理人
主权项
地址