| 摘要 |
PROBLEM TO BE SOLVED: To provide an abrasive pad capable of ensuring the feed and discharge of a slurry, substantially perfectly controlling the number, size and shape of holes for performing the retaining, feed and discharge of the slurry, and reducing the frequency of the renewing of an abrasive surface or dispensing with the renewing. SOLUTION: A photo-curable resin is successively layered in twenty layers while hardening by a thickness of 100 μm by use of a molding device to provide the abrasive pad having holes opened to the abrasive surface, pipes at least partially communicating with the holes and formed horizontally, and grooves formed on the reverse side. The abrasive pad is substantially perfectly controlled in the shape, size and number of the holes to be formed, and the same can be said for an abrasive pad of a different lot. Therefore, a wafer can be polished with extremely high uniformity. The abrasive pad has particularly high discharging ability of the spent slurry. |
