| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition which is excellent in electrical insulation properties and heat resistance and can give a cured item excellent in impact resistance. SOLUTION: This resin composition contains (A) a copolymer comprising (a) phenolic-ring-containing structural units represented by formula (1) and (b) structural units derived from an ethylenically unsaturated compound, (B) a compound having at least two epoxy groups, and (C) a curing agent provided the ethylenically unsaturated compound, when polymerized alone, gives a homopolymer having a glass transition temperature of 0 deg.C or lower. The composition is thermally cured to obtain the cured item.
|
