| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid sealing resin composition which seals semiconductor elements and the like, wherein it has a higher reliability. SOLUTION: There are provided a liquid sealing resin composition comprising (A) an epoxy resin A represented by formula (1) (wherein n is an integer of 1-50), (B) an epoxy resin B represented by formula (2) [wherein R=CnH2n+1 (n is 0-2)], (C) a curing agent and (D) silica, and a semiconductor device manufactured by sealing a semiconductor element with the liquid sealing resin composition.
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