发明名称 SOLDERING METHOD BY LIGHT BEAM
摘要 PROBLEM TO BE SOLVED: To provide a soldering method by a light beam, by which the quality of soldering becomes satisfactory and the quality of a circuit board can be improved. SOLUTION: A soldering method by heating witch the light beam, by which the quality of the whole printed circuit board can be improved, is as follows, that is, in heating until thread solder 6 is supplied to the land 9 of the printed circuit board 7, by heating the surroundings of the land 9 of the printed circuit board 7 by the defocus 4 (a) or the defocus 4 (b) of an emitted beam 3, and by preventing the local parts of the land from being oxidized by heating caused by an increase in the temperature of the whole printed circuit board, the quality of soldering is improved. Further by reheating by the defocus 4 (a) or the defocus 4 (b) of the beam 3, and bar heating and removing the excess components of the residue of flux spread around the land after soldering, the quality of the whole printed circuit board can be improved.
申请公布号 JP2001246460(A) 申请公布日期 2001.09.11
申请号 JP20000056804 申请日期 2000.03.02
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MIZUUCHI SHOICHI
分类号 B23K1/005;B23K1/00;B23K1/018;H05K3/34;(IPC1-7):B23K1/005 主分类号 B23K1/005
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