| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material which has good sealability, excellent mold releasability, and excellent moldability, and improved in package staining, and is useful for sealing, and to provide an electronic part device having one or more elements and sealed with the epoxy resin molding material. SOLUTION: This epoxy resin molding material consists essentially of (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E) a linear polyethylene oxide having a number-average mol.wt. of >=2,000, and (F) a compound obtained by esterifying a 5 to 30Cα-olefin/maleic anhydride copolymer with a 5 to 25C monohydric alcohol, and the electronic part device has one or more elements and is sealed with the epoxy resin molding material.
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