High-melting polyamide resin compositions and molded articles thereof

摘要

High-melting polyamide resin compositions having improved mechanical properties, and molded articles for electrical and electronic components made using the same. The high-melting polyamide resin compositions comprise an aromatic polyamide having a melting point of 280° C. to 340° C. and glycidyl isocyanurate, a novolak-epoxy, or mixtures thereof.