| 摘要 |
PROBLEM TO BE SOLVED: To suppress variation of printing densities by uniformizing thermal accumulation at a portion in the vicinity of a heating element. SOLUTION: A thin glass layer as a circuit substrate 22 having an insulation property is formed on an upper side of a glass substrate as an insulation substrate 21 to form a two-layer structure. A heating element 13 and a wiring electrode 14 are provided to the top face of the circuit substrate 22 and the top of the heating element is covered with a protection film 15 by glass coating. When the heating element 13 is activated by a print signal using the wiring electrode 14, the heating element 13 heats. The heat is transferred to a printing medium through the protection film 15 and to a heat-accumulating body 23 through the circuit substrate 22. The thermal conductivity of the heat- accumulating body 23 is high so that the heat is quickly transferred to the heat-accumulating body 23 even when each heating element has a different time calorific value, thereby uniformizing a temperature of the whole accumulation body. The temperature influence to each of the heating elements is made uniform and the variation in the printing density is eliminated. The power consumption on the heating element is made half.
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