| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition applicable to insertion mounting and surface mounting, which is excellent in room- temperature shelf stability, fluidity, curing characteristics upon molding, and particularly in resistance to solder cracking, although it uses an epoxy resin of a low water absorption and a low viscosity. SOLUTION: The epoxy resin composition comprises, as essential components, (A) an epoxy resin represented by formula (1), (B) a phenolic resin curing agent, (C) a curing accelerator, which is a molecular association comprising a tetra- substituted phosphonium (X), a compound (Y) having two or more phenolic hydroxy groups in a molecule, and a conjugated base of the compound (Y) having two or more henolic hydroxy groups in a molecule, the conjugated base comprising a phenoxide compound formed by removing one hydrogen from the compound (Y) having two or more phenolic hydroxy groups in a molecule, and (D) an inorganic filler, which accounts for 60-92 wt.% of the total epoxy resin composition.
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