Semiconductor package having enhanced ball grid array protective dummy members

摘要

A semiconductor package having: a chip-sized wiring board that has a predetermined wiring pattern; a semiconductor chip that is mounted on the wiring board and is electrically connected to the wiring pattern; sealing resin that seals at least the connection part of the wiring board and the semiconductor chip; an array of solder balls for external circuit connection that are connected through an opening in the sealing resin to a land of the wiring pattern; anda protective member that is disposed along at least two sides of the surface where the array of solder balls are provided.