| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has excellent thermal strength and excellent soldering resistance and is used for sealing semiconductors. SOLUTION: This epoxy resin composition for sealing semiconductors, is characterized by consisting essentially of (A) an epoxy resin, (B) a phenolic resin, (C) a compound represented by general formula (1) [R1 is a 1 to 10C alkoxy; R2 is a 1 to 10C alkyl; (n) is an integer of 1 to 3] and/or the hydrolyzate of the compound of represented by the general formula (1), (D) an inorganic filler, and (E) a curing accelerator.
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