Alignment method for semiconductor optical devices upon carriers

摘要

To mount two semiconductor optical devices together such that a coupling face of one is aligned with and close to the coupling face of the other the devices are mounted on two different carriers. One of the carriers is flat and has a vertical edge and carries the optical device such that its coupling face is flush with the vertical edge. The other carrier is wedge-shaped and has a vertical edge and carries the other optical device such that its coupling face is flush with that vertical edge. A flat baseplate supports the flat carrier. The wedged carrier is supported on an inclined plane which may be formed on a separate wedge supported on the baseplate or which may be formed as an inclined surface portion on the baseplate. By sliding the flat carrier relative to the wedged carrier and sliding the wedged carrier up or down the inclined plane the coupling faces may be aligned. The application of liquid adhesive facilitates the sliding action and permits easy securing after alignment by curing the adhesive.