| 摘要 |
Hydrotalcite compounds useful as additives to synthetic resins such as epoxy resins which are used as, in particular, sealant for semiconductor devices such as transister, IC, LSI and the like, which are characterized by having a composition represented by the formula (1) below:in which M2+ is at least one of Mg2+ and Zn2+,x is a positive number in the range of 0.2<=x<=0.5,A2- is at least one of CO32- and SO42-, andm is a number in the range of 0-2,and having a uranium (U) content of not more than 10 ppb, an average secondary particle size of not more than about 3 mum and a BET specific surface area of not more than 30 m2/g.
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