| 摘要 |
PROBLEM TO BE SOLVED: To provide a package having a thin metal board as a board for an LED chip in place of a conventional printed circuit board(PCB) or a lead frame. SOLUTION: A package for a surface-mounted light emitting diode comprises a metal board 60 equipped with pins 61 and 62 separated from each other, slits 70 that are each provided at the one end of each pin, a light emitting diode chip 80 electrically connected to the pin 61 out of the pins, a bonding wire 40 which connects the other pin 62 to the light emitting diode chip, and a mask 90 which covers the upper part of the metal board so as to protect the light emitting diode chip 40 and the bonding wire 40. |
