| 摘要 |
PROBLEM TO BE SOLVED: To provide materials for a multilayer circuit board that have high adhesion property between electric insulation layers and excellent insulation and heat resistance properties, and at the same time prevent cracks or the like from being generated in copper foil when laminating onto an inner-layer substrate. SOLUTION: In the materials for the multilayer circuit board, a curable composition layer is provided on the surface of the copper foil where surface roughness Rz should be 0.5 to 20μm, Ra should be 0.1 to 5μm, thickness should be o 3 to 75μm, pull strength should be 5 to 50 kgf/mm2 at 180 deg.C, and at the same time elongation should be 5 to 50% at 180 deg.C. The manufacturing method of the multilayer circuit board has a process that overlaps an inner-layer substrate and the materials for the multilayer circuit board and carries of pressing and heating for laminating, a process that allows metal foil to be subjected to etching elimination, a process that uses laser for punching a via hole, and a process that uses electroless plating or a combination of electroless plating and electroplating for forming wiring. |
