发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor light emitting device having a plurality of semiconductor light emitting elements which makes it possible to form current constriction structures in a simple and optimized condition. SOLUTION: On a substrate, a first laminate ST1 composed of at least a first conductive first clad layer, a first active layer and a second conductive second clad layer is formed by laminating in a semiconductor light emitting element forming region, and a second laminate ST2 composed of at least a first conductive third clad layer, a second active layer and a second conductive fourth clad layer is formed by laminating in a second semiconductor light emitting element forming region. Next, a first protective film MS1 and a second protective film MS2 for protecting current injection regions are formed in layers above the first laminate and the second laminate, respectively. Next, in the second laminate a current constriction structure (RD2) is formed protecting the first laminate. Next, in the first laminate a current constriction structure (41a) is formed protecting the second laminate.
申请公布号 JP2001244546(A) 申请公布日期 2001.09.07
申请号 JP20000102864 申请日期 2000.02.29
申请人 SONY CORP 发明人 KAMEI MASABUMI;NEMOTO KAZUHIKO
分类号 H01S5/026;H01S5/22;(IPC1-7):H01S5/026 主分类号 H01S5/026
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