SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor that is excellent in high density and size reduction and can be used for a small semiconductor package to be prevented against package cracking and excellent in reliability, and a manufacturing method of its substrate for mounting the semiconductor excellent in efficiency. SOLUTION: This substrate for mounting the semiconductor comprises an insulating substrate with flexibility and a wiring conductor, and the insulating substrate has high moisture permeability.