MOUNTING STRUCTURE, METHOD FOR MOUNTING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT REMOVING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a structure for facilitating a removal of a semiconductor integrated circuit chip and assuring reliability in flip-chip connection, to provide a method for mounting the chip and to provide a method and an apparatus for removing an electronic component. SOLUTION: A flip-chip connecting structure uses two types of resins soluble and insoluble in a resin uses to adhere the semiconductor integrated circuit chip to a circuit board.