COPPER PLATED TAPE FOR FLEXIBLE SUBSTRATE, COMPONENT THEREWITH, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a component wherein a circuit is formed to be used for a COF method with a suitability for transportation and processing in a conven tional TAB tape manufacturing line, and to provide a semiconductor device. SOLUTION: A copper plated tape for a flexible substrate consists of an insulation film (A) provided with an electrically conducting part on the surface, and a film (C) for reinforcement provided on the reverse side of the electrically conductive part of this insulation film through an adhesive layer (B). The reinforcement film can be easily peeled from the insulation film and the bending resistance is 5×10-4 to 1×10-1N.