MODULAR ELECTRICAL CONNECTOR

摘要

A modular construction of connectors is provided for reducing the effects of the differential coefficient of thermal expansion of the connectors and the underlying circuit board. Each connector of the modular construction is mounted on a known circuit board or the like and could receive therein an integrated circuit chip carrier or cou ld mount to another board. The principle of solder surface tension and self centering characterized in ball grid array (BGA) surface mount technology is used to form an array connector havi ng multiple components that form a larger array pattern or group of arrays.