发明名称 Improved electrical power module construction/assembly technique having outer area equipotential bar with power components directly attached and inner area printed circuit board/electronic component contacts.
摘要 The electrical module construction and assembly technique has an equipotential connection bar (1) to which are directly attached power modules (3). A central area printed circuit (7) has electronic components and provides thermal dissipation. there are printed circuit contacts (4) to the power components. There is an isolating layer (16).
申请公布号 FR2805961(A1) 申请公布日期 2001.09.07
申请号 FR20000002837 申请日期 2000.03.06
申请人 SAGEM SA 发明人 PLOIX OLIVIER DOMINIQUE
分类号 H05K1/02;H05K3/20;H05K3/40;H05K5/00;H05K7/20;(IPC1-7):H05K7/02;H05K1/18 主分类号 H05K1/02
代理机构 代理人
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