发明名称 |
Improved electrical power module construction/assembly technique having outer area equipotential bar with power components directly attached and inner area printed circuit board/electronic component contacts. |
摘要 |
The electrical module construction and assembly technique has an equipotential connection bar (1) to which are directly attached power modules (3). A central area printed circuit (7) has electronic components and provides thermal dissipation. there are printed circuit contacts (4) to the power components. There is an isolating layer (16).
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申请公布号 |
FR2805961(A1) |
申请公布日期 |
2001.09.07 |
申请号 |
FR20000002837 |
申请日期 |
2000.03.06 |
申请人 |
SAGEM SA |
发明人 |
PLOIX OLIVIER DOMINIQUE |
分类号 |
H05K1/02;H05K3/20;H05K3/40;H05K5/00;H05K7/20;(IPC1-7):H05K7/02;H05K1/18 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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