SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To defeat the mounting limit of electricity by inputting/outputting a high speed signal by light and inputting/outputting only the signal whose speed is changed to low by electricity in a package. SOLUTION: An optical signal processing layer having structure where an optical signal is made incident from the vertical direction of a substrate and a semiconductor electronic circuit layer are separately manufactured. The electrode face of the optical signal processing layer and the electrode face of a semiconductor electronic circuit surface are joined buy regular flip chip bonding technology, and the rear face of the semiconductor device is similar to a conventional semiconductor integrated electric circuit. Previous package technology can be used for heat radiation. Since an optical waveguide and a light receiving/ emitting part are manufacture by a series of processes by using regular semiconductor generation technology in the optical signal processing layer, difficult optical system positioning such as a case when light is made incident on a light/electricity fusing integrated circuit from outside through an optical system is not required.