| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor integrated circuit device capable of a fine wiring process and also having the same function as that of a conventional device, and its manufacturing method. SOLUTION: A first electrode pad 3 is provided on the circuit forming plane side of an IC chip 2 and a first insulating layer 4 is arrayed in the area except on the first electrode pad 3. A second insulating layer 7 composed of a material having photosensitivity, has an opening which exposes at least on part of the first electrode pad 3, a wiring 6, and at least one part of a second electrode pad 5, and is arrayed on the first insulating layer 4 is provided on the first insulating layer 4. The wiring 6 and the second electrode pad 5 are formed by filling an opening part of the second insulating layer 7 with conductive particles. |
