| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can prevent deviation in position of a chip before soldering is completed by keeping force for holding a mounted chip while maintaining a gap necessary between the chip and the substrate, and also provide a method of manufacturing the same. SOLUTION: A fine solder paste is screen-printed on lands 12 of a substrate 11. The screen-printed substrate 11 is reflowed and heated to supply solder 14 onto the lands 12. After printing a thermosetting epoxy resin paste in a part of the substrate 11 inside the lands 12, a heat treatment is performed to form resin columns 15. On this substrate 11, a bare chip 17 having solder bumps 18 is mounted. Thereafter, the substrate 11 mounted with the bare chip 17 is reflowed and heated to solder the bare chip 17 on the lands 12 and mount the bare chip 17 on the substrate 11. Then, underfill resin 20 is supplied between the bare chip 17 and the substrate 11 and then a heat treatment is performed to cure the resin 20.
|
