发明名称 COMPLETELY AMORPHOUS SOURCE/DRAIN FOR WET JUNCTION
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a semiconductor device having an SOI structure operating by improved performance compared to a conventional SOI device, by forming a junction leaking path which consistently and effectively diffuses a main body charge during the operation of the device in the source area and the drain area of SOI structure. SOLUTION: The semiconductor device of SOI structure has a source area and a drain area, which are formed by injecting silicon or germanium ions in a silicon layer and which are made to be amorphous. The completely amorphous source area and the drain area, bring permanent crystal defects and diffuse a charge in a device main body. Thus, the leak of a p-n junction improving the whole efficiency and performance of the device is generated.
申请公布号 JP2001244477(A) 申请公布日期 2001.09.07
申请号 JP20010017463 申请日期 2001.01.25
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 SCOTT CLAUDER;SCHEPIS DOMINIC J;MELANIE J SHERONY
分类号 H01L29/78;H01L21/265;H01L21/336;H01L29/786;(IPC1-7):H01L29/786 主分类号 H01L29/78
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