INSULATING SUBSTRATE WITH ADHESIVE USED FOR SUBSTRATE FOR MOUNTING SEMICONDUCTOR, ITS MANUFACTURING METHOD, SUBSTRATE FOR MOUNTING SEMICONDUCTOR USING IT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an insulating substrate with an adhesive that is excellent in high density and size reduction and can be used for a small semiconductor package to be prevented against package cracking and excellent in reliability, its manufacturing method, a substrate for mounting a semiconductor using it, and a manufacturing method of its substrate for mounting the semiconductor excellent in efficiency. SOLUTION: The insulating substrate with the adhesive used for the substrate for mounting the semiconductor comprises the insulating substrate with flexibility and the adhesive, and either of the insulating substrate or the adhesive has high moisture permeability.