IMAGE PICKUP DEVICE, AND IMAGE PICKUP DEVICE ASSEMBLING METHOD

摘要

An image pickup device wherein integrally formed on a three-dimensional printed board (1) are a lens (2), an optical filter (3), a semiconductor image pickup element (4), a chip part (8), a printed board (10), etc., and considerations are given to the mounting construction and the bonding method for the lens (2), the color of the adhesive agent, the masking of the lens (2), etc., thereby realizing a construction capable of attaining high performance, small size, light weight, ruggedness, and mass production and also realizing a high-grade image.