发明名称 |
HEAT-CONDUCTING ADHESIVE COMPOUND AND A METHOD FOR PRODUCING A HEAT-CONDUCTING ADHESIVE COMPOUND |
摘要 |
The invention relates to a heat-conducting adhesive compound between two workpieces (1, 2). Said compound is provided with a sintered layer (3) that consists of heat-conducting powder, is arranged between the two workpieces and contacts each workpiece in a two-dimensional manner. The inventive compound is also provided with an adhesive (4') which fills openings (33) on the surface (31) of the layer and adheres to the two workpieces. In a preferred embodiment, the sintered layer consists of silver powder. The sintered layer is produced between the workpieces and said layer is subsequently filled with a liquid adhesive (4) which is then hardened. |
申请公布号 |
WO0165603(A1) |
申请公布日期 |
2001.09.07 |
申请号 |
WO2001DE00054 |
申请日期 |
2001.01.09 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;SCHWARZBAUER, HERBERT |
发明人 |
SCHWARZBAUER, HERBERT |
分类号 |
C09J5/00;C09J201/00;H01L21/58;H01L23/36;H01L23/373 |
主分类号 |
C09J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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