发明名称 HEAT-CONDUCTING ADHESIVE COMPOUND AND A METHOD FOR PRODUCING A HEAT-CONDUCTING ADHESIVE COMPOUND
摘要 The invention relates to a heat-conducting adhesive compound between two workpieces (1, 2). Said compound is provided with a sintered layer (3) that consists of heat-conducting powder, is arranged between the two workpieces and contacts each workpiece in a two-dimensional manner. The inventive compound is also provided with an adhesive (4') which fills openings (33) on the surface (31) of the layer and adheres to the two workpieces. In a preferred embodiment, the sintered layer consists of silver powder. The sintered layer is produced between the workpieces and said layer is subsequently filled with a liquid adhesive (4) which is then hardened.
申请公布号 WO0165603(A1) 申请公布日期 2001.09.07
申请号 WO2001DE00054 申请日期 2001.01.09
申请人 SIEMENS AKTIENGESELLSCHAFT;SCHWARZBAUER, HERBERT 发明人 SCHWARZBAUER, HERBERT
分类号 C09J5/00;C09J201/00;H01L21/58;H01L23/36;H01L23/373 主分类号 C09J5/00
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