发明名称 CONDUCTIVE COATING ARRANGEMENT FOR EMI SHIELD
摘要 <p>The present invention concerns a reinforced conductive layer (7). The layer is applied at a part (3a, b) of an electrical unit, e.g. a mobile telephone, which is to come into contact with another part (3a, b). The layer (7) will protect the covered material against corrosion due to formation of a galvanic element. In a preferred embodiment of the invention the layer (7) is made of the same material as the part (3a, b) which it will come into contact with. Furthermore, spaces (16) may be formed in assembly of a mobile telephone, which spaces (16) are surrounded by conductive material.</p>
申请公布号 WO2001065902(A1) 申请公布日期 2001.09.07
申请号 SE2001000445 申请日期 2001.03.02
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