| 摘要 |
PROBLEM TO BE SOLVED: To provide a positive type photosensitive composition having improved adhesion in etching to a silicon substrate used in the production of a semiconductor device or a liquid crystal display, a silicon oxide film, a silicon nitride film, a simple metallic film, a metal oxide film, an alloy film, a transparent electrically conductive film or the like. SOLUTION: In the photosensitive composition containing an alkali-soluble resin and a quinonediazido compound, a compound with a specified structure having a 4-thiazolyl group is contained. |
