| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing printed circuit board by which any positional deviation is not be generated between a through-hole and a via-hole. SOLUTION: An aperture for via-hole 42 is formed on an interlayer insulation layer 40 on a core board 30. Before or after formation of this via-hole, a hole 46 for the through-hole is formed with the same laser processor. Thereby, the positional deviation between the through-hole and via-hole can be eliminated.</p> |
