| 摘要 |
<p>A pressure-sensitive adhesive sheet and a covered structure which are less apt to adversely influence hard-disk devices and the like. The covered structure is constituted of a pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer and a pressure-sensitive adhesive sheet substrate and a release sheet comprising a release agent layer and a release sheet substrate, the adhesive sheet being covered with the release sheet so that the release agent layer is in contact with the pressure-sensitive adhesive layer. In the covered structure, the pressure-sensitive adhesive sheet has a silicone content of 500 νg/m2 or lower. The total amount of NO¿x??-, Cl-, PO¿4?3-, F-, K+, Na+¿, and Ca2+ contained in the pressure-sensitive adhesive sheet is preferably 20 mg/m2 or smaller. The pressure-sensitive adhesive sheet, when heated at 85°C for 30 minutes, preferably has a gas generation amount of 20 mg/m2 or smaller.</p> |
