SOLID-STATE IMAGE PICKUP DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To reduce that the resolution of a solid-state image pickup element becomes irregular inside a plane. SOLUTION: The manufacturing method comprises a process in which the bottom of the housing 1d of a package 1 is coated with an adhesive 15 having a prescribed thickness in a scattered dot shape. The method comprises a process in which the parallelism on the surface of the package 1 and that on the surface of the solid-state image sensing element 3 are aligned with a reference face and in which the element 3 is moved toward the housing 1d. The method comprises a process in which the rear surface of the element 3 is brought into contact with the adhesive 15, and in which the movement of the element 3 is stopped in a stage that it does not come into contact with the bottom face of the housing 1d. The method comprises a process in which the adhesive 15 is hardened in a state that the element 3 is raised on the adhesive 15, and in which the element 3 is fixed to the housing 1d.