INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a structure and a method wherein a chip connection (controlled collapse chip connection: C4) which performs connection to the outside by Cu wiring and which controls corrosion and a wire bonding can be used in an integrated circuit. SOLUTION: (A) A conductor segment on the integrated circuit which comprises a contact region for electric connection is provided. (B) A bonding pad is provided. (C) A conductive barrier layer which is arranged between the contact region and the bonding pad is provided. The movement of the component of the conductor segment to the bonding pad from the contact region is prevented.