| 摘要 |
A small-sized image pickup module, which is intended to facilitate assembling operation and reduce cost, comprising a base plate, an image pickup semiconductor device chip, a spectacle frame body, an infrared ray blocking filter, a lens, a diaphragm, a transparent member, and a potting material. The base plate is made of nonmetal including ceramic. The image pickup semiconductor device chip includes a two-dimensional C-MOS image sensor, etc., attached onto the base plate. The spectacle frame body is attached onto the base plate in such a manner as to contain the image pickup semiconductor device chip. The infrared ray blocking filter, lens, and diaphragm are respectively attached to the spectacle frame body. The transparent member is disposed between the base plate and the mirror image in such a manner as to protect the surface area of the image pickup semiconductor device chip. The potting material is disposed to cover the electrode leads in the periphery of the image pickup semiconductor device chip and to bond the peripheral portion of the transparent member simultaneously. |
