| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an apparatus skid where a piping of an auxiliary device or the like fro supporting a semiconductor processing tool can be installed easily. SOLUTION: A device skid 1 includes a plurality of device sections 14 and 16 and a service section 18. An auxiliary device is fitted within the device section. The device sections and service section are communicated with each other in inline relation, permitting an external connection between the auxiliary device and semiconductor processing tool, and then a frame work is arranged as to pass through an area covering the foot print of the service section. The device section and service section are preferably covered with an enclosing body, thus preventing leakages.</p> |
