METHOD FOR MANUFACTURING TAPE CARRIER FOR TAB

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a tape carrier for TAB which prevents an aggravation of meltability of a tin plated film by preventing deterioration of the tin plated film formed on the lead side and stabilizes the connectivity with an electrode of a semiconductor chip. SOLUTION: A method includes plating with setting a ratio of Sn (IV) for total tin in an electroless tin plating solution 14 to less than 50%.