| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of forming many connection pads in a nearly same height within an electronic component mounting area in a main surface, mounting an electronic component having many connection terminals, and that can be easily manufactured. SOLUTION: This wiring board 1 has a plurality of connection pads within the electronic component mounting area (e) in the main surface 2 on an insulating layer 3. External connection pads 16 disposed near to the outside of the area (e) in the connection pads conduct with via conductors 12 buried in the insulating layers 3, 4 at the outside of the area (e) and internal connection pads 15 disposed near to the inside of the area (e) in the connection pads are formed on the via conductors 12 buried through the insulating layers 4 within the area (e). In addition, both the internal and external connection pads 15, 16 are formed in the nearly same height near to the main surface 2, and at least the internal connection pads 15 are formed so as to contain the upper edge (a conductive part 14) of the via conductors 12 thereunder. |
