| 摘要 |
PROBLEM TO BE SOLVED: To solve conventional drawbacks wherein heat for melting a sealing material causes characteristic degradation of an electronic component stored in a package. SOLUTION: In a package for storing the electronic component wherein an insulating substrate 1 and a cover body 2 are connected via the sealing material 8 and the electronic component 3 is air-tightly stored within the package 4 constituted of the insulating substrate 1 and the cover body 2, the sealing material 8 comprises a glass component constituted of silver oxide of 20-40 wt.%, silver iodide of 5-20 wt.%, phosphorus pentoxide of 20-30 wt.%, boron oxide of 5-15 wt.%, and zinc oxide of 1-6 wt.%, and a filler of 10-30 wt.% of a solid solution constituted of zirconium phosphate, zirconium oxide, and niobium oxide. A glass softening point of the sealing material is equal to or higher than 260 deg.C. The cold temperature molten glass enables a more reliable hermetic seal and the electronic component 3 within the package 4 to operate with stability and normally over long term.
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