| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency module which can stably derive stable shield characteristics with a simple structure and has sufficiently large area for component mounting. SOLUTION: This high-frequency module component comprises a substrate 1 for component mounting, an electronic component 2 equipped with terminal electrodes 21 and 22 mounted on the substrate 1, a resin coating member 3 which has a conduction hole 31 reaching a terminal electrode 21 having the ground potential of the electronic component 2, and a shield metal film 4 which covers the resin coating material 3.
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