发明名称 HEAT SHIELD STRUCTURE OF TELEPHONE SET
摘要 PROBLEM TO BE SOLVED: To prevent the temperature of the reception part of a handset from rising owing to the heat generation of an electronic component mounted on a substrate. SOLUTION: The hot air generated by the heat generation of the electronic component mounted on the substrate 4 in a housing 3 is guided to an air outlet 10 through a shield plate 11 to prevent the hot air and heat from reaching a reception part mount part 6a and the hot air from flowing out of button holes 7.
申请公布号 JP2001244673(A) 申请公布日期 2001.09.07
申请号 JP20000056895 申请日期 2000.03.02
申请人 OKI ELECTRIC IND CO LTD 发明人 ITO MASAYA;YAMAZAKI TAKAYOSHI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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